High-Efficiency Step-Up Converters
for White LED Main and Subdisplay Backlighting
When laying out a board, minimize trace lengths
between the IC and R SENSE , the inductor, the diode,
the input capacitor, and the output capacitor. Keep
traces short, direct, and wide. Keep noisy traces, such
Pin Configurations (continued)
TOP VIEW
(BALLS SOLDERED DOWN)
as the LX node trace, away from CS. The input bypass
capacitor (C IN ) should be placed as close to the IC as
1
2
3
4
possible. For the thin QFN package, PGND and GND
A
V+
VP
CTRL
COMP
should be connected directly to the exposed paddle
underneath the IC. The ground connections of C IN and
C OUT1 should be as close together as possible. The
B
PGND
GND
traces from IN to the inductor and from the Schottky
diode to the LEDs can be longer.
C
LX
MAX1582
EN1
Chip Information
TRANSISTOR COUNT: 2546
D
OUT1
OUT2
CS
EN2
PROCESS: BiCMOS
UCSP
Ordering Information
PART
TEMP RANGE PIN-PACKAGE
TOP
MARK
MAX1582Y EBE-T -40 ° C to +85 ° C 16 UCSP-16
MAX1582YEBE+T -40 ° C to +85 ° C 16 UCSP-16
1582YEBE
1582YEBE
MAX1582YETC
-40 ° C to +85 ° C 12 Thin QFN-EP*
AAEV
MAX1582YETC+ -40 ° C to +85 ° C 12 Thin QFN-EP*
AAEV
* EP = Exposed paddle.
+ Denotes lead-free package.
UCSP is a trademark of Maxim Integrated Products, Inc.
8
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相关代理商/技术参数
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MAX1582YETC 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
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